Selasa, 28 April 2015

^ Get Free Ebook Ceramic Interconnect Technology HandbookFrom CRC Press

Get Free Ebook Ceramic Interconnect Technology HandbookFrom CRC Press

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Ceramic Interconnect Technology HandbookFrom CRC Press

Ceramic Interconnect Technology HandbookFrom CRC Press



Ceramic Interconnect Technology HandbookFrom CRC Press

Get Free Ebook Ceramic Interconnect Technology HandbookFrom CRC Press

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Ceramic Interconnect Technology HandbookFrom CRC Press

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.

Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates.

Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

  • Sales Rank: #4107946 in Books
  • Published on: 2007-01-24
  • Original language: English
  • Number of items: 1
  • Dimensions: 9.47" h x 1.14" w x 6.49" l, 1.71 pounds
  • Binding: Hardcover
  • 456 pages

About the Author
University of Idaho, Moscow, USA University of Arkansas, Fayetteville, USA

Most helpful customer reviews

1 of 1 people found the following review helpful.
Excellent Source of Technical Information on Co-Fired Ceramics
By Worldwide
Perfect book to introduce you to the world of multilayer co-fired ceramics (LTCC, HTCC, Thick Film, etc.), includes detailed information about each step in the manufacturing process, specially screen printing.

I highly recommend it!

See all 1 customer reviews...

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^ Get Free Ebook Ceramic Interconnect Technology HandbookFrom CRC Press Doc

^ Get Free Ebook Ceramic Interconnect Technology HandbookFrom CRC Press Doc

^ Get Free Ebook Ceramic Interconnect Technology HandbookFrom CRC Press Doc
^ Get Free Ebook Ceramic Interconnect Technology HandbookFrom CRC Press Doc

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